| PART |
Description |
Maker |
| GBL08 GBL01 GBL010 GBL005 GBL02 GBL04 GBL06 |
Aluminum Polymer SMT Capacitor; Capacitance: 150uF; Voltage: 16V; Case Size: 8x7 mm; Packaging: Tape & Reel
Aluminum Polymer SMT Capacitor; Capacitance: 1500uF; Voltage: 2.5V; Case Size: 8x12 mm; Packaging: Tape & Reel
Aluminum Polymer SMT Capacitor; Capacitance: 2200uF; Voltage: 2.5V; Case Size: 10x10 mm; Packaging: Tape & Reel
Aluminum Polymer SMT Capacitor; Capacitance: 470uF; Voltage: 16V; Case Size: 10x10 mm; Packaging: Tape & Reel
4.0A GLASS PASSIVATED BRIDGE RECTIFIER
|
Won-Top Electronics Co., Ltd.
WTE[Won-Top Electronics]
|
| G681 G680 |
Microprocessor Reset IC
Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 16V; Case Size: 4.3x7.3 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 1.5uF; Voltage: 16V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
|
List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| IR1150 |
Similar to the IR1150S with Tape and Reel packaging
|
IRF
|
| 0878580450 87858-0450 |
2.00mm (.079) Pitch Milli-Grid?/a> Breakaway Header, Surface Mount, Single Row, Vertical, without Peg, with Kapton Tape, Tape on Reel Packaging
2.00mm (.079) Pitch Milli-Grid Breakaway Header, Surface Mount, Single Row, Vertical, without Peg, with Kapton Tape, Tape on Reel Packaging
|
Molex Electronics Ltd.
|
| FQD13N10TF FQD19N10TF |
D-PAK Tape and Reel Data
D-PAK Tape and Reel Data D-PAK Packaging Configuration: Figure 1.0
|
Fairchild Semiconductor
|
| DL126TRD DL126TRS |
Tape & Reel and Packaging Specifications for Small-Signal Transistors, FETs and Diodes
|
ON Semiconductor
|
| KA8513B/C KA8513B KA8513C |
FM IF RECEIVER
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel 引言
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 16V; Case Size: 1.4x2.6 mm; Packaging: Tape & Reel
|
Samsung Electronic
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| GBJ1010 GBJ10005 GBJ1001 GBJ1002 GBJ1004 GBJ1006 G |
Aluminum Polymer SMT Capacitor; Capacitance: 6.8uF; Voltage: 25V; Case Size: 6.3x6 mm; Packaging: Tape & Reel 10 A, 400 V, SILICON, BRIDGE RECTIFIER DIODE
10 Amp Glass Passivated Bridge Rectifier 50 to 1000 Volts
Aluminum Polymer SMT Capacitor; Capacitance: 82uF; Voltage: 20V; Case Size: 10x8 mm; Packaging: Tape & Reel 10 A, 100 V, SILICON, BRIDGE RECTIFIER DIODE
|
MCC[Micro Commercial Components]
Micro Commercial Components, Corp.
|
| TL1270F160REQBT TL1270F250REQBT TL1270F160YEQBT TL |
LED Illumination, Tape & Reel packaging, Right angle design
LED Illumination, Tape & Reel packaging, Right angle design
|
E-SWITCH
|
| JG7905 |
Tantalum Conformal-Coated Capacitor; Capacitance: 68uF; Voltage: 6.3V; Packaging: Tape & Reel
JG7905
|
PerkinElmer Inc.
PERKINELMER[PerkinElmer Optoelectronics]
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
